The term 3D IC generally means an IC package having multiple device layers, which is
different with 3D transistor structures such as the FinFET. 3D packaging and 3D integration …

As a high-precision angular rate sensor, the Frequency-Modulated (FM) gyroscope based
on MEMS craft has attracted more and more attention in recent years, owing to its …

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more
than twice as much new content, adding the latest developments in circuit models …

Over the past decade, system-on-chip (SoC) designs have evolved to address the ever
increasing complexity of applications, fueled by the era of digital convergence …

An authoritative, systematic, and comprehensive description of current CMP technology
Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of …

Graphene (Gr) nanosheets with multilayer structures were dispersed in a nickel (Ni) plating
solution by using a surfactant with a magnetic stirring method. Gr nanosheets were …

We report the fabrication of dense arrays of super-hydrophilic Cu microposts at solid
fractions as high as 58% and aspect ratios as high as four using electrochemical deposition …

The BOSCH etch process, which is commonly used in microelectromechanical system
fabrication, has been extensively investigated in this work for implementation in through …

As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …

Copper electrodeposition in high-aspect-ratio through-holes micromachined by deep
reactive ion etching is one of the most essential processes for fabricating through-wafer …