Airgap interconnects: Modeling, optimization, and benchmarking for backplane, pcb, and interposer applications

V Kumar, R Sharma, E Uzunlar, L Zheng… - IEEE Transactions …, 2014 - ieeexplore.ieee.org
Frequency and time domain models are developed for backplane (BP), printed circuit board
(PCB), and silicon interposer (SI) links using six-port transfer matrices (ABCD matrices) for …

A silicon interposer platform utilizing microfluidic cooling for high-performance computing systems

L Zheng, Y Zhang, MS Bakir - IEEE Transactions on …, 2015 - ieeexplore.ieee.org
In this paper, a silicon interposer platform using microfluidic cooling is proposed for high-
performance computing systems. The key advantage of the the silicon interposer is its very …

Modeling and optimization approaches for benchmarking emerging on-chip and off-chip interconnect technologies

V Kumar - 2014 - repository.gatech.edu
Modeling approaches are developed to optimize emerging on-chip and off-chip electrical
interconnect technologies and benchmark them against conventional technologies. While …