Novel nanostructured thermal interface materials: a review
The trend of continuing miniaturisation of microelectronics leads to new thermal
management challenges. A key point in the heat removal process development is to improve …
management challenges. A key point in the heat removal process development is to improve …
Modulating heat transport inside CNT assemblies: multi-level optimization and structural synergy
Due to their ultra-high thermal conductivity, carbon nanotubes (CNTs) have become a hot
spot for thermal enhancement materials. However, many researchers have found that the …
spot for thermal enhancement materials. However, many researchers have found that the …
Functionalization mediates heat transport in graphene nanoflakes
The high thermal conductivity of graphene and few-layer graphene undergoes severe
degradations through contact with the substrate. Here we show experimentally that the …
degradations through contact with the substrate. Here we show experimentally that the …
Nanoscale Heat Transport of Vertically Aligned Carbon Nanotube Bundles for Thermal Management Applications
J Spièce, K Lulla… - … Applied Materials & …, 2024 - ACS Publications
Electronic devices continue to shrink in size while increasing in performance, making excess
heat dissipation challenging. Traditional thermal interface materials (TIMs) such as thermal …
heat dissipation challenging. Traditional thermal interface materials (TIMs) such as thermal …
Review of current progress of thermal interface materials for electronics thermal management applications
Increasing power densities within microelectronic systems place an ever increasing demand
on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at …
on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at …
Degradation of carbon nanotube array thermal interface materials through thermal aging: Effects of bonding, array height, and catalyst oxidation
Carbon nanotube (CNT) array thermal interface materials (TIMs) are promising candidates
for high-performance applications in terms of thermal performance. However, in order to be …
for high-performance applications in terms of thermal performance. However, in order to be …
A pyrenylpropyl phosphonic acid surface modifier for mitigating the thermal resistance of carbon nanotube contacts
Efforts to utilize the high intrinsic thermal conductivity of carbon nanotubes (CNTs) for
thermal transport applications, namely for thermal interface materials (TIMs), have been …
thermal transport applications, namely for thermal interface materials (TIMs), have been …
Classical to quantum transition of heat transfer between two silica clusters
Heat transfer between two silica clusters is investigated by using the nonequilibrium Green's
function method. In the gap range between 4 Å and 3 times the cluster size, the thermal …
function method. In the gap range between 4 Å and 3 times the cluster size, the thermal …
Preparation of antistatic polystyrene superfine powder with polystyrene modified carbon nanotubes as antistatic agent
M Zhang, C Zhang, Z Du, H Li, W Zou - Composites Science and …, 2017 - Elsevier
A facile approach for fabricating antistatic polystyrene (PS) microspheres used in 3D print
had been carried out by introducing polystyrene onto the MWCNTs (MWCNTs@ PS) …
had been carried out by introducing polystyrene onto the MWCNTs (MWCNTs@ PS) …
Nanoscale azide polymer functionalization: a robust solution for suppressing the carbon nanotube–polymer matrix thermal interface resistance
The large thermal resistance across the carbon nanotube (CNT)–polymer matrix interface is
a limiting factor for achieving polymer composites with high thermal conductivities. Using …
a limiting factor for achieving polymer composites with high thermal conductivities. Using …