(57) ABSTRACT A semiconductor structure includes a first die including a first surface and a
second surface opposite to the first surface; a molding surrounding the first die; a first via …

Various molded chip combinations and methods of manu facturing the same are disclosed.
In one aspect, a molded chip combination is provided that includes a first semicon ductor …

Devices, packaging devices, and methods of packaging semiconductor devices are
disclosed. In some embodiments, a packaged semiconductor device includes a molding …

Integrated fan-out packages and methods of forming the same are disclosed. An integrated
fan-out package includes a first semiconductor chip, a plurality of through integrated fan-out …

(2013 01); H01 L 21/485 (201301); H0 IL 21/486 (2013 01); H01 L 21/4853 (2013 01); H01L
21/4857 (2013 01); H01L 21/663 (201301); H01 L 23/49822 (2013 01); H0IL 23/49827 …

A semiconductor package includes: a semiconductor chip having an active surface, having
connection pads disposed thereon, and an inactive surface, opposing the active surface; an …

Various multi-die arrangements and methods of manufac turing the same are disclosed. In
one aspect, a semiconduc tor chip device is provided that includes a first molding layer and …

Integrated fan-out packages and methods of forming the same are disclosed. An integrated
fan-out package includes a bump structure, a polymer layer and a metal layer. The bump …

An integrated circuit structure that includes a first integrated circuit package and a second
integrated circuit package is described. The two packages can be stacked above, for …

Provided are a semiconductor package and method for manufacturing the same. The
semiconductor package includes a first semiconductor chip. A first mold layer is disposed on …