Probe3. 0: A systematic framework for design-technology pathfinding with improved design enablement

S Choi, J Jung, AB Kahng, M Kim… - … on Computer-Aided …, 2023 - ieeexplore.ieee.org
We propose a systematic framework to conduct design-technology pathfinding for power,
performance, area, and cost (PPAC) in advanced nodes. Our goal is to provide a …

[Retracted] Research and Development of Digital Assembly Process System for Ultrasonic Transducers

X Feng, X Zhu, W Zhao, R Shi - Security and Communication …, 2022 - Wiley Online Library
In order to solve the problem of design efficiency of the digital assembly process, the author
proposes a research using ultrasonic transducer technology. The main content of this …

Acceleration on Physical Design: Machine Learning-based Routability Optimization

S Park, D Kim, S Kang - Proceedings of the 2023 ACM International …, 2023 - dl.acm.org
Design rule violation (DRV) is one of the significant challenges in designing integrated
circuits. To successfully manufacture a chip, it is crucial to create a DRV clean layout …

[图书][B] Robust Physical Design and Design Technology Co-Optimization Methodologies at Advanced VLSI Technology

M Kim - 2023 - search.proquest.com
The semiconductor industry has achieved remarkable progress by adhering to Moore's Law
in the past few decades. As a result, technology has continuously scaled down and …

System-level evaluation of 3D power delivery network at 2nm node

G Sisto, R Chen, D Milojevic… - DTCO and …, 2023 - spiedigitallibrary.org
Fine-pitch 3D integration is considered a promising way to advance traditional CMOS
scaling as 3D interconnects are currently capable to match the connectivity among …