(57) ABSTRACT A package structure, including a bridge, an interposer, a first redistribution
structure layer, a second redistribution struc ture layer, and multiple chips, is provided. The …

(57) ABSTRACT A method of manufacturing a semiconductor device includes: coupling a
semiconductor die to a protection layer; forming a first redistribution layer over the …

An integrated substrate structure includes a redistribution film, a circuit substrate, and a
plurality of conductive features. The redistribution film includes a fine redistribution circuitry …

In an embodiment, a structure includes a core substrate, a redistribution structure coupled,
the redistribution structure including a plurality of redistribution layers, the plurality of …

(57) ABSTRACT A semiconductor package includes a bottom package and an upper
redistribution layer disposed on the bottom package. The bottom package includes a …

A chip package device includes a chip, and a first substrate and a second substrate that are
disposed opposite to each other, where the chip is disposed on a surface that is of the first …

In one example, a semiconductor device comprises a first base substrate comprising a first
base conductive structure, a first encapsulant contacting a lateral side of the first base …

A package includes a first layer of molding material, a first metallization layer on the first
layer of molding material, a second layer of molding material on the first metallization layer …

A semiconductor package includes a first redistribution substrate, a first semiconductor chip
mounted on the first redistribution substrate, a first molding layer on the first redistribution …

A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer
disposed on the load board, and copper core balls. The ceramic interposer has first and …