We review the current state-of-the-art graphene-enhanced thermal interface materials for the management of heat in the next generation of electronics. Increased integration densities …
SH Song, KH Park, BH Kim, YW Choi, GH Jun… - Advanced …, 2013 - researchgate.net
The thermal properties of materials are becoming increasingly important in tandem with the need for more efficient heat removal in numerous systems such as LEDs,[1] CMOS,[2] and …
H Kim, E Brueckner, J Song, Y Li… - Proceedings of the …, 2011 - National Acad Sciences
Properties that can now be achieved with advanced, blue indium gallium nitride light emitting diodes (LEDs) lead to their potential as replacements for existing infrastructure in …
A Sevincer, A Bhattarai, M Bilgi… - … Surveys & Tutorials, 2013 - ieeexplore.ieee.org
Recently, rapid increase of mobile devices pushed the radio frequency (RF)-based wireless technologies to their limits. Free-space-optical (FSO), aka optical wireless, communication …
High-power Light Emitting Diode (LED) technology has developed rapidly in recent years from illumination to display applications. However, the rate of heat generation increases with …
X Lu, TC Hua, Y Wang - Microelectronics Journal, 2011 - Elsevier
The goal of this study is to improve the thermal characteristics of high power LED (light- emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of …
X Luo, S Liu - IEEE Transactions on Advanced Packaging, 2007 - ieeexplore.ieee.org
In this paper, a microjet-based cooling system is proposed for the thermal management of high-power light-emitting diodes (LEDs). Preliminary experimental investigation and …
X Lu, TC Hua, M Liu, Y Cheng - Thermochimica Acta, 2009 - Elsevier
The goal of this study is to improve the thermal characteristics of high-power LED (light emitting diode) package by using a loop heat pipe. The heat-release characteristics of high …
S Liu, J Yang, Z Gan, X Luo - International Journal of Thermal Sciences, 2008 - Elsevier
Based on the previous experiments and simulations reported by the present authors, it was found the cooling system could be optimized to obtain better performance. In this paper, the …