High density interconnection printed circuit board PCB puts forward high requirements for
defect free blind holes copper filling. Here, 5-amino-1, 3, 4-thiadiazole-2-mercaptan, a small …

Leveler is one of the most important additives for super-conformal copper electroplating,
which has been widely applied in the fabrication of nanoscale (or microscale) interconnect …

A novel chlorinated functional group-modified triphenylmethane derivative leveler BB1 is
used to achieve superconformal electrodeposition in microvias. Cyclic voltammetry (CV) and …

Electroplating additives, especially levelers of copper electroplating, are the most critical
components of electroplating solutions in the manufacture of printed circuit boards and …

In this work, a novel, simple, and green citrate-based copper electronic electroplating bath
with the characteristics of weak corrosion, low copper ion concentration, and simple …

Background Cu pattern electroplating plays an essential role in the interconnection and
microstructure fabrication of high-power device packaging. However, improving efficiency …

We synthesize new triethylene glycol-based levelers containing quaternary ammonium
groups with different terminal functional groups (allyl, propyl, benzyl, and naphthylmethyl) to …

Accelerators are indispensable additives for super-conformal copper electrodeposition,
which has been widely applied in the fabrication of integrated circuits (ICs), printed circuit …

A defect free copper interconnect is crucial for ensuring the electrical connection and
transmission of high-density interconnect printed circuit boards. Leveling agent is a key …

The roughness and mechanical properties of ultra‐low profile electrolytic copper foil
seriously affect and restrict its application in high‐frequency/high‐speed printed circuit …