Machining technologies and structural models of microfluidic devices
P Gou, S Meng, H Yan, J Liu… - Proceedings of the …, 2024 - journals.sagepub.com
In the past decades, microfluidic chips have been one of the hottest research topics in the
“lab-on-a-chip” field. However, it is still a challenge for design the perfect microchannels with …
“lab-on-a-chip” field. However, it is still a challenge for design the perfect microchannels with …
Plasma activated titanium-based bonding for robust and reliable Si–Si and Si-glass integration
F Niu, S Yang, X Yuan, Q Kang, L Liu, C Wang - Ceramics International, 2024 - Elsevier
The exceptional biocompatibility of Ti/Ti bonding technology makes it highly significant for
the sealing of implantable devices. However, achieving highly reliable Ti/Ti bonding at low …
the sealing of implantable devices. However, achieving highly reliable Ti/Ti bonding at low …
Investigation on the effects of low-temperature anodic bonding and its reliability for MEMS packaging using destructive and non-destructive techniques
R Joyce, M George, L Bhanuprakash… - Journal of Materials …, 2018 - Springer
Excellence in the performance of MEMS-based devices such as RF switches, microfluidics,
and pressure sensors are well known and by now reported. Operations of these devices are …
and pressure sensors are well known and by now reported. Operations of these devices are …
Stress reduction in silicon/oxidized silicon–Pyrex glass anodic bonding for MEMS device packaging: RF switches and pressure sensors
Standard temperature for anodic bonding process (usually 450° C) degrade the MEMS
device performance due to stress generated on mechanical components during wafer level …
device performance due to stress generated on mechanical components during wafer level …
Study on the mechanism of Si–glass–Si two step anodic bonding process
L Hu, H Wang, Y Xue, F Shi… - Journal of Micromechanics …, 2018 - iopscience.iop.org
Si–glass–Si was successfully bonded together through a two-step anodic bonding process.
The bonding current in each step of the two-step bonding process was investigated, and …
The bonding current in each step of the two-step bonding process was investigated, and …
MEMS 阳极键合界面层的力学行为研究进展.
胡宇群， 董明佳 - … of Nanjing University of Aeronautics & …, 2015 - search.ebscohost.com
回顾了微纳机电系统(M ic ro/N anoe le c tr o-mechan ic alsystem, MEMS/NEMS)
器件工业中所用键合技术的发展和应用, 总结了作为其中关键键合技术之一的阳极键合在微纳 …
器件工业中所用键合技术的发展和应用, 总结了作为其中关键键合技术之一的阳极键合在微纳 …
Low-Bow Glass-Si Anodic Wafer Bonding at High Temperature by Means of CTE Engineering of Corning Novel Fusion Glass
A Rad - 2023 IEEE SENSORS, 2023 - ieeexplore.ieee.org
In this study, a nearly bow-free anodic bond with high bond strength using SUSS MicroTec
manual wafer bonder between Si and SG3. 3+ fusion glass from Corning Inc. by means of …
manual wafer bonder between Si and SG3. 3+ fusion glass from Corning Inc. by means of …
A new method for fast anodic bonding in microsystem technology
Other than temperature and voltage, load plays a key role in anodic bonding process. In this
paper we present a new design of top electrode (cathode) for anodic bonding machine by …
paper we present a new design of top electrode (cathode) for anodic bonding machine by …
Construction of a spherically bent crystal analyzer through anodic bonding for a non-resonant inelastic X-ray scattering spectrometer
D Ketenoglu - Instrumentation Science & Technology, 2021 - Taylor & Francis
The anodic bonding method was used to construct spherically bent crystal analyzers for a
synchrotron radiation based non-resonant inelastic X-ray scattering spectrometer to probe …
synchrotron radiation based non-resonant inelastic X-ray scattering spectrometer to probe …
Low-temperature bonding and interfacial failure behavior of Si/glass and glass/glass chips
Silicon and glass, as the two most common substrates in the semiconductor field, can be
integrated into optoelectronic devices, micro/nanofluidic chips and even extended to …
integrated into optoelectronic devices, micro/nanofluidic chips and even extended to …