Investigating the impact of different solder alloy materials during laser soldering process

Z Bachok, A Abas, HF Tang, MZH Nazarudin… - Soldering & Surface …, 2024 - emerald.com
Purpose This study aims to investigate the influence of different solder alloy materials on
passive devices during laser soldering process. Solder alloy material has been found to …

Effect of different solder volumes on the laser soldering process: numerical and experimental investigation

Z Bachok, MA Abas… - Journal of …, 2022 - asmedigitalcollection.asme.org
Laser soldering is becoming more popular for soldering pin through-hole (PTH) components
onto printed circuit boards (PCBs). Solder volume influences soldering joint reliability …

Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing

MSM Sunar, MA Bakar, A Atiqah, A Jalar… - Soldering & Surface …, 2023 - emerald.com
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing |
Emerald Insight Books and journals Case studies Expert Briefings Open Access Publish with us …

Numerical simulation and experimental study on wetting of Sn-based solder for laser soldering

F Li, Q Wang, J Shu, H Chen, H Li - Journal of Mechanical Science and …, 2024 - Springer
Abstract iSoldering_wetting software was used to simulate the solder wetting process in
laser soldering. Based on the simulation, the range of process parameters was initially …

Structural analysis on nanocomposites lead free solder using nanoindentation

Z Bachok, AA Saad, MA Abas, MYT Ali… - Journal of Advanced …, 2022 - jamt.utem.edu.my
As lead-based solder has been restricted, the microelectronics industry has been looking for
lead-free solder like SAC. But there have been cases of solder joints failing, reducing …

Moisture Content and Early Corrosion Detection of Cu Wire Bonding in a Semiconductor Package

S Supramaniam, MA Bakar, A Atiqah, A Jalar… - Journal of Failure …, 2023 - Springer
The early corrosion detection of a semiconductor package is the desired goal for industrial
semiconductor manufacturing owing to its capability to predict corrosion activity before the …

Role of alternating current shape on microstructure and damage evolution of solder joints

WA Siswanto, AY Krasnopevtsev… - Journal of Manufacturing …, 2020 - Elsevier
Motivated by recent works indicating the role of AC current on the reliability of electronic
systems, the microstructural characterization and mechanical properties of solder joints, as …

[引用][C] Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

LA Olenev, RR Zakieva, NN Smirnova… - Soldering & Surface …, 2022 - emerald.com
Purpose This study aims to present a more accurate lifetime prediction model considering
solder chemical composition. Design/methodology/approach Thermal cycling and standard …