Method of manufacturing a release film as isolation film in package
HJ Tsou, CW Wu, P Wang, SW Lu, YC Shih… - US Patent …, 2019 - Google Patents
(57) ABSTRACT A method includes forming a release film over a carrier, forming a metal
post on the release film, encapsulating the metal post in an encapsulating material …
post on the release film, encapsulating the metal post in an encapsulating material …
Integrated fan-out packages and methods of forming the same
CW Wu, YC Shih, SW Lu, JC Lin, LH Lee - US Patent 10,510,595, 2019 - Google Patents
(57) ABSTRACT A method of forming a semiconductor device includes attaching a metal foil
to a carrier, the metal foil being pre-made prior to attaching the metal foil; forming a …
to a carrier, the metal foil being pre-made prior to attaching the metal foil; forming a …
Integrated fan-out packages
S Jeng, C Dai-Jang, HT Lu, HW Liu, CH Lin… - US Patent …, 2020 - Google Patents
An integrated fan-out package includes a first semiconductor chip, a plurality of through
integrated fan-out vias, an encapsulation layer and a redistribution layer structure. The first …
integrated fan-out vias, an encapsulation layer and a redistribution layer structure. The first …
Package of integrated circuits having a light-to-heat-conversion coating material
HJ Tsou, CW Wu, P Wang, SW Lu, YC Shih… - US Patent …, 2021 - Google Patents
(57) ABSTRACT A method includes forming a release film over a carrier, forming a metal
post on the release film, encapsulating the metal post in an encapsulating material …
post on the release film, encapsulating the metal post in an encapsulating material …
Chip package device
T Jiajie, YE Guanhong, LIN Laicun, G Liu… - US Patent …, 2022 - Google Patents
A chip package device includes a chip, and a first substrate and a second substrate that are
disposed opposite to each other, where the chip is disposed on a surface that is of the first …
disposed opposite to each other, where the chip is disposed on a surface that is of the first …
Method of forming integrated fan-out packages with built-in heat sink
CW Wu, YC Shih, SW Lu, JC Lin, LH Lee - US Patent 12,148,661, 2024 - Google Patents
A method of forming a semiconductor device includes attaching a metal foil to a carrier, the
metal foil being pre-made prior to attaching the metal foil; forming a conductive pillar on a …
metal foil being pre-made prior to attaching the metal foil; forming a conductive pillar on a …
Semiconductor package and method of manufacturing the semiconductor package
S Lee, J Kim, LEE Yongkoon - US Patent 12,040,299, 2024 - Google Patents
A semiconductor package includes a support member, a semiconductor chip arranged in the
support member such that a front surface and a backside surface of the semiconductor chip …
support member such that a front surface and a backside surface of the semiconductor chip …
Semiconductor package and method of manufacturing the semiconductor package
S Lee, J Kim, LEE Yongkoon - US Patent 11,735,553, 2023 - Google Patents
A semiconductor package includes a support member, a semiconductor chip arranged in the
support member such that a front surface and a backside surface of the semiconductor chip …
support member such that a front surface and a backside surface of the semiconductor chip …
Semiconductor package including heat dissipation structure
Y Park, M Kang, KO Youngchan, S Lee - US Patent 11,804,444, 2023 - Google Patents
A semiconductor package includes; a semiconductor chip including a top surface and an
opposing bottom surface, a heat dissipation structure including a lower adhesive layer …
opposing bottom surface, a heat dissipation structure including a lower adhesive layer …
Chip packaging method and package structure
C Jimmy - US Patent 11,610,855, 2023 - Google Patents
US11610855B2 - Chip packaging method and package structure - Google Patents
US11610855B2 - Chip packaging method and package structure - Google Patents Chip …
US11610855B2 - Chip packaging method and package structure - Google Patents Chip …