Emerging GaN technologies for power, RF, digital, and quantum computing applications: Recent advances and prospects

K Hoo Teo, Y Zhang, N Chowdhury… - Journal of Applied …, 2021 - pubs.aip.org
GaN technology is not only gaining traction in power and RF electronics but is also rapidly
expanding into other application areas including digital and quantum computing electronics …

Gallium nitride vertical power devices on foreign substrates: a review and outlook

Y Zhang, A Dadgar, T Palacios - Journal of Physics D: Applied …, 2018 - iopscience.iop.org
Vertical gallium nitride (GaN) power devices have attracted increased attention due to their
superior high-voltage and high-current capacity as well as easier thermal management than …

GaN-based power devices: Physics, reliability, and perspectives

M Meneghini, C De Santi, I Abid, M Buffolo… - Journal of Applied …, 2021 - pubs.aip.org
Over the last decade, gallium nitride (GaN) has emerged as an excellent material for the
fabrication of power devices. Among the semiconductors for which power devices are …

High-performance GaN vertical fin power transistors on bulk GaN substrates

M Sun, Y Zhang, X Gao… - IEEE Electron Device …, 2017 - ieeexplore.ieee.org
This letter reports a GaN vertical fin power field-effect-transistor structure with submicron fin-
shaped channels on bulk GaN substrates. In this vertical transistor design only n-GaN layers …

GaN FinFETs and trigate devices for power and RF applications: Review and perspective

Y Zhang, A Zubair, Z Liu, M Xiao… - Semiconductor …, 2021 - iopscience.iop.org
Gallium nitride (GaN) is becoming a mainstream semiconductor for power and radio-
frequency (RF) applications. While commercial GaN devices are increasingly being adopted …

Correlation between dislocations and leakage current of pn diodes on a free-standing GaN substrate

S Usami, Y Ando, A Tanaka, K Nagamatsu… - Applied Physics …, 2018 - pubs.aip.org
Dislocations that cause a reverse leakage current in vertical pn diodes on a GaN free-
standing substrate were investigated. Under a high reverse bias, dot-like leakage spots …

Large-area 1.2-kV GaN vertical power FinFETs with a record switching figure of merit

Y Zhang, M Sun, J Perozek, Z Liu… - IEEE Electron …, 2018 - ieeexplore.ieee.org
This letter presents the first experimental study on capacitances, charges, and power-
switching figure of merits (FOM) for a large-area vertical GaN power transistor. A 1.2-kV, 5-A …

Vertical GaN junction barrier Schottky rectifiers by selective ion implantation

Y Zhang, Z Liu, MJ Tadjer, M Sun… - IEEE Electron …, 2017 - ieeexplore.ieee.org
This letter demonstrates vertical GaN junction barrier Schottky (JBS) rectifiers fabricated with
novel ion implantation techniques. We used two different methods to form the lateral pn grids …

Materials and processing issues in vertical GaN power electronics

J Hu, Y Zhang, M Sun, D Piedra, N Chowdhury… - Materials Science in …, 2018 - Elsevier
Silicon-based power devices are reaching their fundamental performance limit. The use of
wide-bandgap semiconductors with superior material properties over silicon offers the …

(Ultra) wide-bandgap vertical power FinFETs

Y Zhang, T Palacios - IEEE Transactions on Electron Devices, 2020 - ieeexplore.ieee.org
FinFET is the backbone device technology for CMOS electronics at deeply scaled
technology nodes per Moore's law. Recently, the FinFET concept has been leveraged to …