Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic
packaging applications. Ag NPs have emerged as a promising low-temperature bonding …

To meet the requirement of bonding power chips in microelectronic packaging, low
temperature sintering silver (Ag) nanopaste appears to be the most interesting choice in …

Currently, the demand by new application scenarios of increasing operating device
temperatures in power systems is requiring new die-attach materials with higher melting …

In this work, an organic-free silver nanostructured film (SNF) was applied to bond SiC chips
and ceramic substrates, which was fabricated by ultrafast pulsed laser deposition (PLD) …

In this work, thermal characteristic of silver–copper (Ag–Cu) nanopaste that consists of a
mixture of nano-sized Ag and Cu particles and organic compounds meant for high …

In this work, mechanical properties of Ag–Cu nanopaste that formulated by mixing Ag and
Cu nanoparticles with organic compounds have been reported. Various weight percents of …

Owing to its cost-effectiveness and low coefficient of thermal expansion (CTE), micron Si is
incorporated into sintered Ag matrix to develop an Ag@ Si composite sintering strategy. The …

Semiconductor nanocrystals and metal nanoparticles are the building blocks of the next
generation of electronic, optoelectronic, and photonic devices. Covering this rapidly …

In order to ensure the high-temperature reliability of device in high temperature service, a
new sintered structure layer, nano-Ag paste filling graphene reinforced Ni foam, was …

A silver-copper (Ag-Cu) nanopaste that formulated by mixing Ag and Cu nanoparticles with
an organic binder and solvent system for high-temperature die-attach application has been …