Sn whiskers are thin filaments that grow spontaneously out of the surface of coatings on Cu
and have become a critical reliability problem in Pb-free electronics. In this review, we focus …

The spontaneous growth and evolution mechanism of metal whiskers have long been
scientific problems. With the development of the integration of electronic and electrical …

We investigate whisker nucleation and growth kinetics in Sn coatings induced by the
application of mechanical pressure. The pressure was applied to the samples using a …

Here, we attempt to understand the age-old question of “where do whiskers in Sn coatings
grow?” by performing grain orientation mapping in conjunction with a simple analysis of the …

Whiskering is a spontaneous filamentary growth of material, and it is a major long-term
reliability issue affecting microelectronic packages comprising Sn plating and Sn-rich …

We report on real-time measurements that enable us to watch the morphology of whiskers
and hillocks forming in real-time and provide insight into the mechanisms controlling their …

The viscoplastic behavior of as-fabricated, undamaged, microscale Sn-3.0 Ag-0.5 Cu
(SAC305) Pb-free solder is investigated and compared with that of eutectic Sn-37Pb solder …

This article describes the results of a whisker formation study on SAC305 assemblies,
evaluating the effects of lead-frame materials and cleanliness in different environments: low …

An innovative controllable way has been proposed to mitigate tin whisker growth by
inserting Ni nanocones prepared by electrodeposition. The results reveal that, after inserting …

The main attraction of cellular automaton (CA) method used in computational material
science lies on not only the simulation of recrystallization without the complicated differential …