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Koh et al. US PATENT DOCUMENTS 2004/006 1238 A1 4/2004 Sekine 2004/0104454 A1 …

Configurations are disclosed for a health system to be used in various healthcare
applications, eg, for patient diagnostics, monitoring, and/or therapy. The health system may …

A microelectronic unit can include a substrate having front and rear surfaces and active
semiconductor devices therein, the substrate having a plurality of openings arranged in a …

(57) ABSTRACT A microelectronic assembly can include a Substrate having first and
second Surfaces, at least two logic chips overlying the first surface, and a memory chip …

The present invention relates to packaging of microelec tronic devices and interposer
structures, especially conduc tive via structures and methods of forming Such via structures …

(57) ABSTRACT A microelectronic structure has active elements defining a storage array,
and address inputs for receipt of address infor mation specifying locations within the storage …

2010-11-08 Assigned to TESSERA RESEARCH LLC reassignment TESSERA RESEARCH
LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS) …

(57) ABSTRACT A method of forming a semiconductor package comprises forming one or
more first vias in a first side of a substrate and attaching a first side of a first microelectronic …

A method of fabricating a microelectronic unit includes providing a semiconductor element
having a front Surface and a rear Surface remote from the front Surface, forming at least one …

6,864,172 B2 3/2005 Noma et al. 2008/0090333 A1 4, 2008 Haba et al. 6,867,123 B2
3/2005 Katagiri et al. 2008/0099900 A1* 5/2008 Oganesian et al............ 257,678 6,879,049 …