An 1830 GHz Vector-Sum Phase Shifter With Two-Stage Transformer-Based Hybrid in 130-nm SiGe BiCMOS
Y Yu, Y Wu, P Tang, C Zhao, H Liu… - … on Circuits and …, 2023 - ieeexplore.ieee.org
This article presents an 18~ 30 GHz vector-sum phase shifter for wireless application in the
millimeter-wave regime. It is composed of an I/Q signal generator, two variable-gain …
millimeter-wave regime. It is composed of an I/Q signal generator, two variable-gain …
Integrated scalable and tunable RF CMOS SOI quadrature hybrid coupler
V Knopik, B Moret, E Kerherve - 2017 12th European …, 2017 - ieeexplore.ieee.org
Hybrid is a key component in RF and Microwave design, and particularly for balanced power
amplifier (PA). This paper describes a pragmatic approach of the quadrature hybrid …
amplifier (PA). This paper describes a pragmatic approach of the quadrature hybrid …
Wideband and compact 3-D quadrature coupler for 5G applications
A wideband and compact quadrature coupler intended for 5G applications is presented. The
circuit is integrated using a dedicated cost-effective three-dimensional (3-D) technology and …
circuit is integrated using a dedicated cost-effective three-dimensional (3-D) technology and …
Miniaturized lange bridge design for 5G millimeter waves communication
Y Liao, G Qian, Y Han - 2019 International Applied …, 2019 - ieeexplore.ieee.org
With the rapid development of 5G millimeter wave communication, the requirements for
miniaturization of communication devices are getting higher and higher. In this paper, using …
miniaturization of communication devices are getting higher and higher. In this paper, using …
Integration of Lange Couplers in SiGe BiCMOS technology for RF and mm-Wave applications perspectives for distributed Chip-Package-PCB Co-integration
S Wane, L Leyssenne, O Tesson… - 2015 European …, 2015 - ieeexplore.ieee.org
SiGe BiCMOS design solutions for Lange Couplers operating in the mm-Wave domain are
proposed. Various circuit topologies are designed, fabricated, and experimentally compared …
proposed. Various circuit topologies are designed, fabricated, and experimentally compared …
Chip-Package-PCB Co-Design of Power Combiners in SESUB and WLCSP Technology with Re-Distribution Layers
TV Dinh, S Wane, D Lesénéchal… - 2018 IEEE Radio …, 2018 - ieeexplore.ieee.org
We present SESUB (Semiconductor Embedded in Substrate) and WLCSP (Wafer-Level-
Chip-Scale Packaging) integration of Power Combiners for WLAN and 5G applications. The …
Chip-Scale Packaging) integration of Power Combiners for WLAN and 5G applications. The …
Intégration de dispositifs passifs 3D compacts et performants. Application à la réalisation d'une matrice de Butler 4× 4 en bande Ka.
A Cayron - 2020 - laas.hal.science
La complexité des systèmes RF intégrés pour les applications sans fil grand public s' accroit,
et exige de revisiter l'intégration des circuits passifs RF et microondes. De nouvelles …
et exige de revisiter l'intégration des circuits passifs RF et microondes. De nouvelles …
[引用][C] Systemkonzepte und integrierte Schaltungen für Radarsensoren für das vollautomatisierte Fahren
J Schöpfel - Dissertation, Bochum, Ruhr …
[引用][C] 3-D integration of compact and high-performance passive devices. Application to the development of a 4× 4 Butler matrix operating in Ka band.
A Cayron - 2020 - INSA de Toulouse