An efficient analysis using the contour integral method (CIM) for the modeling of
inhomogeneous substrates with circular or arbitrarily shaped dielectric inclusions in planar …

The effects of an edge-located electromagnetic bandgap (EL-EBG) structure including a
defected ground structure (DGS) on the cavity-mode resonances of power/ground planes …

In this paper, we present for the first time a rigorous crosstalk analysis of through silicon via
(TSV) arrays consisting of several hundreds of TSVs in interposers with metallized surfaces …

With the rapid increase in the operating frequency and integration density of ball grid array
packages, pin assignment (pinmap) significantly impacts electromagnetic interference (EMI) …

Intelligent pin assignment (pinmap) of ball grid array packages for electromagnetic
interference mitigation is becoming a new trend. A high-performance design methodology …

This article discusses the high-frequency behavior of thru-hole vias enclosed by solid
reference planes in packages and printed circuit boards and reviews some efficient …

The contour integral equation method has been used for system-level power integrity
analysis of electronic packages. But, wideband simulation of complex package structures …

In this paper, the electromagnetic leakage from dense signal/ground vias is calculated by
integral technologies including contour integral method, surface equivalence theorem and …

In this paper, the conventional physics-based via (PBV) model is extended to multilayer
substrate integrated waveguide (SIW) structures with via feeds. Furthermore, a novel PBV …

The rectangular power-ground structure is thoroughly analyzed in time domain. The time-
dependent electric-field distribution within the power-ground structure is expanded in ray …