Ultrasound devices and methods are described, including a repeatable ultrasound
transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and a high-speed serial data …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and an output data module …

Micromachined ultrasonic transducers integrated with complementary metal oxide
semiconductor (CMOS) substrates are described, as well as methods of fabricating such …

Complementary metal oxide semiconductor (CMOS) ultra sonic transducers (CUTs) and
methods for forming CUTs are described. The CUT's may include monolithically integrated …

CMOS Ultrasonic Transducers and processes for making such devices are described. The
processes may include forming cavities on a first wafer and bonding the first wafer to a …

Aspects of the technology described herein relate to ultra Sound device circuitry as may form
part of a single Substrate ultrasound device having integrated ultrasonic transducers. The …

US 2014/0217478 A1 Aug. 7, 2014(Continued) Primary Examiner—Zandra Smith Related
US Application Data Assistant Examiner—Lawrence Tynes, Jr.(60) Provisional application …

Micromachined ultrasonic transducers formed in comple mentary metal oxide semiconductor
(CMOS) wafers are described, as are methods of fabricating Such devices. A metallization …

A semiconductor device has a carrier with a die attach area. A semiconductor die is mounted
to the die attach area with a back surface opposite the carrier. A modular interconnect unit is …