A 3-D TCAD framework for NBTI—Part I: Implementation details and FinFET channel material impact

R Tiwari, N Parihar, K Thakor, HY Wong… - … on Electron Devices, 2019 - ieeexplore.ieee.org
The time kinetics of interface trap generation and passivation (ΔN IT) and its contribution (ΔV
IT) during and after negative bias temperature instability (NBTI) stress is calculated by using …

Modeling of NBTI using BAT framework: DC-AC stress-recovery kinetics, material, and process dependence

S Mahapatra, N Parihar - IEEE Transactions on Device and …, 2020 - ieeexplore.ieee.org
Threshold voltage shift (ΔVT) due to Negative Bias Temperature Instability (NBTI) in p-
MOSFETs is modeled using the BTI Analysis Tool (BAT) framework. The ΔV T time kinetics …

Carat–a reliability analysis framework for bti-hcd aging in circuits

P Gholve, P Chatterjee, C Pasupuleti, H Amrouch… - Solid-State …, 2023 - Elsevier
Abstract Circuit Aging Reliability Analysis Tool (CARAT), a framework that calculates
random activity (frequency and duty) aware degradation of FETs to simulate circuit aging …

A physical model for bulk gate insulator trap generation during bias-temperature stress in differently processed p-channel FETs

T Samadder, N Choudhury, S Kumar… - … on Electron Devices, 2021 - ieeexplore.ieee.org
A deterministic reaction-diffusion–drift model is used for the time kinetics of bulk gate
insulator trap generation in p-channel Field Effect Transistors (FETs) under inversion stress …

A 3-D TCAD framework for NBTI, Part-II: Impact of mechanical strain, quantum effects, and FinFET dimension scaling

R Tiwari, N Parihar, K Thakor, HY Wong… - … on Electron Devices, 2019 - ieeexplore.ieee.org
The TCAD framework developed in part-I of this paper is used to study the impact of fin
length (FL) and fin width (FW) scaling on interface trap generation (ΔV IT) during negative …

Modeling of DC-AC NBTI stress-recovery time kinetics in P-channel planar bulk and FDSOI MOSFETs and FinFETs

N Choudhury, N Parihar, N Goel… - IEEE Journal of the …, 2020 - ieeexplore.ieee.org
The physics-based BTI Analysis Tool (BAT) is used to model the time kinetics of threshold
voltage shift (ΔV T) during and after NBTI in p-channel planar bulk and FDSOI MOSFETs …

Analysis of BTI, SHE Induced BTI and HCD Under Full VG/VD Space in GAA Nano-Sheet N and P FETs

N Choudhury, U Sharma, H Zhou… - 2020 IEEE …, 2020 - ieeexplore.ieee.org
An ultrafast (10ps delay) characterization method is used to measure threshold voltage shift
(ΔV T) owing to Bias Temperature Instability (BTI) and Hot Carrier Degradation (HCD) stress …

NSFET performance optimization through SiGe channel design-A simulation study

SL Cheng, C Li, XY Dong, SS Lv, HL You - Microelectronics Reliability, 2023 - Elsevier
In this article, NSFET performances including DC electrical characteristics, analog/RF
metrics and NBTI degradation are studied using 3D fully-calibrated TCAD simulation …

Bias temperature instability reliability in stacked gate-all-around nanosheet transistor

M Wang, J Zhang, H Zhou… - 2019 IEEE …, 2019 - ieeexplore.ieee.org
In this paper, we report the bias temperature instability (BTI) reliability in stacked gate-all-
around (GAA) nanosheet (NS) devices. We show that, in addition to its superior intrinsic …

Analysis of the hole trapping detrapping component of NBTI over extended temperature range

N Choudhury, N Parihar… - 2020 IEEE International …, 2020 - ieeexplore.ieee.org
An Activated Barrier Double Well Thermionic (ABDWT) model is used to calculat e hole
trapping-detrapping (ΔV HT) kinetics, which, together with generation of interface (ΔV IT) …