Review and analysis of SiC MOSFETs' ruggedness and reliability

J Wang, X Jiang - IET Power Electronics, 2020 - Wiley Online Library
SiC MOSFETs (silicon carbide metal‐oxide semiconductor field‐effect transistors) are
replacing Si insulated gate bipolar transistors in many power conversion applications due to …

A comprehensive study of short-circuit ruggedness of silicon carbide power MOSFETs

G Romano, A Fayyaz, M Riccio… - IEEE Journal of …, 2016 - ieeexplore.ieee.org
The behavior of silicon carbide (SiC) power MOSFETs under stressful short-circuit (SC)
conditions is investigated in this paper. Two different SC failure phenomena for SiC power …

Experimental and theoretical demonstration of temperature limitation for 4H-SiC MOSFET during unclamped inductive switching

J An, S Hu - IEEE Journal of Emerging and Selected Topics in …, 2019 - ieeexplore.ieee.org
This article focuses on the avalanche energy handing ability and theoretical demonstration
of the avalanche failure mechanism for the SiC MOSFET by the unclamped inductive …

Robustness and balancing of parallel-connected power devices: SiC versus CoolMOS

J Hu, O Alatise, JAO Gonzalez… - IEEE Transactions …, 2015 - ieeexplore.ieee.org
Differences in the thermal and electrical switching time constants between parallel-
connected devices cause imbalances in the power and temperature distribution, thereby …

Investigation of failure mechanisms of 1200 V rated trench SiC MOSFETs under repetitive avalanche stress

X Deng, W Huang, X Li, X Li, C Chen… - IEEE transactions on …, 2022 - ieeexplore.ieee.org
In this article, the repetitive avalanche ruggedness of silicon carbide metal–oxide–
semiconductor field-effect transistors (MOSFETs) with asymmetric trench (AT) and double …

A deep insight into the degradation of 1.2-kV 4H-SiC MOSFETs under repetitive unclamped inductive switching stresses

X Zhou, H Su, R Yue, G Dai, J Li… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
In this paper, the long-term reliability of commercial 1.2-kV 4H-SiC MOFSETs under
repetitive unclamped inductive switching stresses is evaluated experimentally. The …

The effect of electrothermal nonuniformities on parallel connected SiC power devices under unclamped and clamped inductive switching

J Hu, O Alatise, JAO Gonzalez… - … on Power Electronics, 2015 - ieeexplore.ieee.org
Nonuniformities in the electrothermal characteristics of parallel connected devices reduce
overall reliability since power is not equally dissipated between the devices. Furthermore, a …

Repetitive unclamped-inductive-switching-induced electrical parameters degradations and simulation optimizations for 4H-SiC MOSFETs

S Liu, C Gu, J Wei, Q Qian, W Sun… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
In this paper, the electrical parameter degradations of high-voltage 4H-SiC MOSFETs under
repetitive unclamped-inductive-switching (UIS) stresses were investigated experimentally …

Investigations on the degradations of double-trench SiC power MOSFETs under repetitive avalanche stress

J Wei, S Liu, L Yang, L Tang, R Lou, T Li… - … on electron devices, 2018 - ieeexplore.ieee.org
The degradations of electrical parameters for double-trench silicon carbide (SiC) power
metal-oxidesemiconductor field-effect transistors (MOSFETs) under repetitive avalanche …

Comprehensive analysis of electrical parameters degradations for SiC power MOSFETs under repetitive short-circuit stress

J Wei, S Liu, L Yang, J Fang, T Li, S Li… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
The degradations of electrical parameters for silicon carbide power MOSFETs under
repetitive short-circuit (SC) stress are investigated in detail in this paper. It demonstrates that …