Extrapolation with Range Determination of 2D Spectral Transposed Convolutional Neural Network for Advanced Packaging Problems
In this article, we propose the application of a 2-D spectral transposed convolutional neural
network (S-TCNN) with extrapolation to reduce the number of trainable parameters during …
network (S-TCNN) with extrapolation to reduce the number of trainable parameters during …
Sub-THz Integrated Circuits: Challenges and Opportunities
A Banerjee - 2024 IEEE 67th International Midwest Symposium …, 2024 - ieeexplore.ieee.org
Integrated circuits (ICs) at sub-terahertz (sub-THz) frequencies can enable many
applications including high data rate wireless communication and high resolution radar. This …
applications including high data rate wireless communication and high resolution radar. This …
Flip-Chip Aperture Coupled D-Band Active Radiator Tiles in 22-nm CMOS FDSOI
A Ayling, A Hajimiri - IEEE Journal of Solid-State Circuits, 2024 - ieeexplore.ieee.org
A D-band active radiator tile is designed in 22-nm CMOS fully depleted silicon on insulator
(FDSOI). The tile uses commercial materials, fabrication, and assembly techniques while …
(FDSOI). The tile uses commercial materials, fabrication, and assembly techniques while …
A Broadband D-Band Cavity-Backed Coupled-Feed Patch Antenna in Wafer-Level Package Based on Heterogeneous Integrations
X Wang, G Xiao, B Zhao, Y Huang… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
This article proposes a broadband cavity-backed coupled-feed patch antenna in wafer-level
package (WLP) for D-band wireless communications. In the Si wafer, a metal cavity is etched …
package (WLP) for D-band wireless communications. In the Si wafer, a metal cavity is etched …
A 1T2R Heterogeneously Integrated Phased-Array FMCW Radar Transceiver With AMC-Based Antenna in Package in the -Band
This article presents a novel 30.5-dBm output power 1 transmitter and 2 receivers (1T2R)
heterogeneously integrated (HI) phased-array frequency-modulated continuous-wave …
heterogeneously integrated (HI) phased-array frequency-modulated continuous-wave …
Glass Interposer with Multiple Embedded Dies for mmWave Applications
This paper presents a multiple-die embedded glass interposer that supports a thermal
management solution for mmWave applications. The interposer includes dies with different …
management solution for mmWave applications. The interposer includes dies with different …
Thermal Isolation Performance of Polyimide Aerogel within a Die-Embedded Glass Interposer
With the continuous miniaturization of microelectronics, the need to effectively prevent
thermal crosstalk between adjacent functional blocks is increasing. This study focuses on …
thermal crosstalk between adjacent functional blocks is increasing. This study focuses on …
A 3-D Heterogeneously Integrated Application of the RF-module with Micro-bump Filter and Embedded AiP at W-Band
In this study, we present the design, fabrication, and measurements of a 3-D heterogeneous
integrated RF-module at W-band. A 3-D transition structure based on micro-bumps is …
integrated RF-module at W-band. A 3-D transition structure based on micro-bumps is …
First demonstration of die-embedded alumina ribbon ceramic (ARC) packaging for 6G wireless applications
This work presents a first demonstration of die embedding in Alumina Ribbon Ceramic
(ARC) as package substrate which is a recent development from Corning Inc. ARC is a thin …
(ARC) as package substrate which is a recent development from Corning Inc. ARC is a thin …
A Low Loss Die-Embedded Glass Substrate for 140 GHz InP Power Amplifier Integration
We present a novel packaging solution for 140 GHz InP power amplifier (PA) integration
using an advanced die-embedded glass substrate. This marks the first functional …
using an advanced die-embedded glass substrate. This marks the first functional …