During soldering and service, intermetallic compounds (IMCs) have an important impact on
the performance and reliability of electronic products. A thin and continuous intermetallic …

The objective of this review is to study the effect of minor alloying and impurity elements,
typically present in electronics manufacturing environment, on the interfacial reactions …

The composition of alloying elements in Sn-rich solder plays a pivotal role in determining the
performance of solder joints in an electronic package. Recently, Indium (In) has attracted …

The influences of In element on microstructure and properties of Sn–Bi based lead-free
solder were investigated in this study. With In element addition, the amount of primary Sn …

The objective of this review is to study the interfacial intermatallic compounds (IMCs)
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …

Recent years, the SnAgCu family of alloys has been found a widely application as a
replacement for the conventional SnPb solders in electronic industry. In order to further …

In today's oil/gas industry, use of drill bits in harsh drilling conditions is demanding the
pursuit of innovated materials for higher performance and efficiency. This paper describes …

The restriction of using toxic and harmful Sn-Pb solders has led to the rapid development of
lead-free solders in recent decades. This research on the effect of indium (In) microalloying …

In order to reduce the price of the SAC357 solder, the percentage of silver was reduced and
simultaneously the Bi-element was added to improve the properties of the solder. For this …

This work investigates the impact of Bi content on the microstructure of solder joints under
various thermal cycling conditions. Five lead-free solder alloys were used to assemble test …