The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy

SP State, S Costovici, M Enachescu, T Visan, L Anicai - Materials, 2024 - mdpi.com
Sn-Cu-Ni lead-free solder alloy electrodeposited on copper substrate from a deep eutectic
solvent (DES)-based electrolyte under direct current (DC) and pulsed current (PC) was …