The use of data-driven methods in fluid mechanics has surged dramatically in recent years
due to their capacity to adapt to the complex and multi-scale nature of turbulent flows, as …

A 3-dimensional enhanced heat pipe radiator (HPR) is developed to meet the requirements
of heat dissipation and temperature uniformity in the cooling of high-power electronic …

This study integrates machine learning, genetic algorithm and computational fluid dynamics
to explore the influence of geometry on the finned heat pipe radiator performance. It also …

This study introduces the novel application of a multi-heat source loop heat pipe (LHP) in
heat spreader. The system efficiently transfers heat from multiple localized sources to a 260 …

The ever-increasing power density of electronic devices fosters development of cooling
systems. Among them, two-phase heat transfer devices in general and Loop Heat Pipes …

摘要随着电子器件不断趋于小型化和高度集成化发展, 电子器件功率过高引发的散热问题亟待
解决. 平板热管由于具有均温性好, 散热效率高等优势已为许多大功率电子元器件的散热问题 …

This study focuses on improving the thermal characteristics of a plate-finned heat sink
(PFHS) by incorporating a vapor chamber (VC) through experimental investigation. The …

The vapor chamber (VC) is considered one of the most effective approaches for heat
dissipation in electronic components. This study investigates experimentally the thermal …

Current trends in technology toward the elimination of fossil fuels are increasing the value of
electric vehicles (EVs). In turn, one of the main components of EVs is an electric motor (EM) …