Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging
J Wu, S Xue, J Wang, S Liu, Y Han, L Wang - Journal of Materials Science …, 2016 - Springer
Abstract Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have
been extensively investigated. With the extensive prevalence of 3D IC package, a major …
been extensively investigated. With the extensive prevalence of 3D IC package, a major …
Microstructure and mechanical properties of Pb-free Sn–3.0 Ag–0.5 Cu solder pastes added with NiO nanoparticles after reflow soldering process
S Chellvarajoo, MZ Abdullah - Materials & Design, 2016 - Elsevier
Incorporating various types of ceramic type nanoparticles into Pb-free solder pastes
produces unique nanocomposite solder pastes. In this study, Sn–Ag–Cu (SAC) 305 solder …
produces unique nanocomposite solder pastes. In this study, Sn–Ag–Cu (SAC) 305 solder …
Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0 Ag–0.5 Cu solder pastes on microstructure and mechanical properties after reflow soldering …
S Chellvarajoo, MZ Abdullah, CY Khor - Materials & Design, 2015 - Elsevier
This paper presents the effects of diamond nanoparticles reinforcement on lead-free SAC
305 solder paste after the reflow soldering process. Different diamond nanoparticles …
305 solder paste after the reflow soldering process. Different diamond nanoparticles …
Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn–58Bi solder joints
T Hu, Y Li, YC Chan, F Wu - Microelectronics Reliability, 2015 - Elsevier
In the present study, the effect of Al 2 O 3 nanoparticles on performances of Sn–58Bi solder
were investigated in aspects of electro-migratio, shear strength and microhardness. The …
were investigated in aspects of electro-migratio, shear strength and microhardness. The …
In-situ alloying of Sn–3.5 Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers
Driven by the necessity to improve the reliability of lead free electronic products and by the
trend towards miniaturization, researchers are putting intense efforts to improve the …
trend towards miniaturization, researchers are putting intense efforts to improve the …
Elevated damping properties of lead-free solders under electric current stressing
W Li, L Liu - Scripta Materialia, 2023 - Elsevier
Abstract Effects of electric current stressing on damping properties of pure Sn, Sn0. 7Cu,
Sn3. 5Ag, and Sn0. 3Ag0. 7Cu were investigated by dynamic mechanical analysis. The …
Sn3. 5Ag, and Sn0. 3Ag0. 7Cu were investigated by dynamic mechanical analysis. The …
Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting …
S Chellvarajoo, MZ Abdullah - Microelectronics Reliability, 2018 - Elsevier
In this study, the effects of three distinctive contents of metal oxide [Iron Nickel Oxide (Fe 2
NiO 4), Iron Oxide (Fe 2 O 3), Nickel Oxide (NiO), and Indium Tin Oxide (ITO)] and carbon …
NiO 4), Iron Oxide (Fe 2 O 3), Nickel Oxide (NiO), and Indium Tin Oxide (ITO)] and carbon …
Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn–0.7 Cu solder
N Zhao, ML Huang, Y Zhong, HT Ma… - Journal of Materials …, 2015 - Springer
The effects of trace RE Ce addition on the microstructure, melting point and wettability of
eutectic Sn–0.7 Cu solder as well as on the interfacial reactions of Sn–0.7 Cu–xCe/Cu (Ni) …
eutectic Sn–0.7 Cu solder as well as on the interfacial reactions of Sn–0.7 Cu–xCe/Cu (Ni) …
Effect of different S AC based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation
FM Mukhtar, A Abas, MS Haslinda… - Journal of Applied …, 2019 - jafmonline.net
The wetting formation and nanoparticles dispersion on adding nanoparticles to the lead free
solder Sn-3.0 Ag-0.5 Cu (SAC305) is methodically investigated using Discrete Phase Model …
solder Sn-3.0 Ag-0.5 Cu (SAC305) is methodically investigated using Discrete Phase Model …