Impact of Plasma Pretreatment and Pore Size on the Sealing of Ultra-Low-k Dielectrics by Self-Assembled Monolayers
Self-assembled monolayers (SAMs) from an 11-cyanoundecyltrichlorosilane (CN-SAM)
precursor were deposited on porous SiCOH low-k dielectrics with three different pore radii …
precursor were deposited on porous SiCOH low-k dielectrics with three different pore radii …
Area selective grafting of siloxane molecules on low-k dielectric with respect to copper surface
A Rezvanov, ES Gornev, JF de Marneffe… - Applied Surface Science, 2019 - Elsevier
The selective pore sealing of porous organosilica glass (OSG k= 2.4) dielectrics by self-
assembled monolayers (SAM) is studied, using three precursors:(3-trimethoxysilylpropyl) …
assembled monolayers (SAM) is studied, using three precursors:(3-trimethoxysilylpropyl) …