Misorientations and subgrains in Sn-Ag and Sn-Ag-Cu solder balls after solidification
S Sun, J Xian, CL Hsieh, CM Gourlay - Journal of Electronic Materials, 2024 - Springer
Subgrains and recrystallisation are common microstructural features in solder joints that
have been subjected to thermal fatigue or mechanical loading. Here we study similar …
have been subjected to thermal fatigue or mechanical loading. Here we study similar …