W-band filters play a crucial role in modern millimeter-wave communication and radar
systems, finding applications in 5G/6G networks, automotive radar, and passive imaging …

A range of ultracompact bandpass filters (BPFs) exploited circular-substrate-integrated
waveguide (CSIW) with low insertion loss (IL) and high selectivity are proposed based on …

Terahertz (THz) technology is poised to revolutionize future wireless communications, and
the silicon substrate-integrated gap waveguide (SSIGW) is emerging as a promising solution …

Through silicon via (TSV) technology is crucial for modern semiconductor device package,
enabling high-performance integrated microsystems. This paper investigates the …

A parametric model is proposed for the coupled stripline coupler with arbitrary operating
frequency and coupling coefficient in silicon-based 3-D RF integration. All the three parts of …

Transformers are the key passive devices in many radio frequency integrated circuit (RF IC)
applications. In this paper, a kind of ultra-high coupling coefficient and symmetric …

The study presents a self-packaged bandpass filter (BPF) with miniaturization and wide
stopband based on shielded stripline resonators using a mixed coupling scheme. First, the …

In this work, an effective and efficient optimization strategy for 3-D inductors based on
through-silicon via (TSV) is proposed. This strategy is based on the nondominated sorting …

Through silicon vias (TSVs) have been considered as an efficient way to establish vertical
signal exchanging channels among stacked dies, offering advantages such as higher …

In this paper, an ultra-miniature W-band bandpass filter (BPF) with ultra-stopband using the
three-dimensional integrated through silicon via (TSV) technology, is proposed. The …