We review five solder joint reactions in 3D IC packaging technology which are of wide
interest:(1) Scallop-type growth of Cu 6 Sn 5 in solid-liquid interdiffusion reaction,(2) Whisker …

Solid-liquid interdiffusion (SLID) bonding was extensively investigated as a potential
bonding method applied to 3D chip stacking because it can be bonded at a low temperature …

Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …

Stacking semiconductor chips allows for increased packing density within a given footprint
and efficient communication between different functional layers of the chip, leading to higher …

The current paper reviews the research conducted on wrought Cu–Sn, Cu–Sn–Ti and Cu–
Sn–Zn alloys intending to reveal the details on morphological and mechanical behaviour …

The process of transient liquid phase bonding to form intermetallic compound solder joints
can effectively achieve 3D chip stack interconnection. However, there are a large number of …

The high performance and downsizing technology of three-dimensional integrated circuits
(3D-ICs) for mobile consumer electronic products have gained much attention in the …

With the electronics packaging industry shifting increasingly to three-dimensional
packaging, microbumps have been adopted as the vertical interconnects between chips …

It is the first time that Cu/Sn films were used to replace micro-bumps to investigate the growth
behavior and formation mechanism of porous Cu 3 Sn in Cu/Sn solder system under high …

Corrosion reliability is a severe concern related no-clean flux (NCF) residue. It results in a
decreased life span of electronic devices, specially fine pitch assemblies. NCFs are …