A method of fabricated a wafer level package is described. In one embodiment, the method
includes fabricating at least one active device on a semiconductor wafer that has not been …

A substrate is electrically connected with an electrical device mounted on the substrate. A
ball bond is formed between a first end of a wire and a bonding pad of the substrate. A …

BACKGROUND Micro electro-mechanical systems (MEMS) devices are devices that
combine mechanical elements and electronic elements on a common substrate. MEMS …

A multi-chip package includes a substrate having first bonding pads and second bonding
pads, a first chip having chip pads on an active surface, spacers attached to the substrate …

A semiconductor package and method of producing the same has a substrate having a resin
layer with first and second surfaces. A plurality of electrically conductive patterns are formed …

As integrated circuits processing technology improves, an increasing number of devices and
functions can be inte grated onto a single chip. However, this creates a need for increasing …

As the continuous shrinkage of the interconnect line width in microelectronics devices, there
is a growing concern about the electromigration (EM) failure of bonding wire. In addition, an …

A semiconductor package is provided and methods for bonding wires in the semiconductor
package. In one implementation, the semiconductor package includes a lead frame …

In a wire-bonding process, a chip is provided with at least a first contact pad. A chip carrier is
further provided with at least a second contact pad. A plurality of stacked conductive bumps …

A method of bonding a wire between a semiconductor die pad and a lead finger of a lead
frame which includes providing a capillary having a bore and a wire pigtail extending …