Direct wafer bonding and thinning technologies are now extensively used in combination to
produce SOI wafers (silicon-on-insulators) or innovative engineered substrates. Emerging …

Microfabricated ion traps are a major advancement towards scalable quantum computing
with trapped ions. The development of more versatile ion-trap designs, in which tailored …

We demonstrate that 18 keV x rays can be used to study organic thin films at the solid-liquid
interface by x-ray reflectivity. We establish that this is a powerful technique for investigating …

The sealing mechanism of silicon bonding interfaces is reported as a function of annealing
temperature. Details of the structural and chemical interface evolution are obtained for …

We present a new experimental scheme for the high-resolution X-ray study of deeply buried
interfaces, as they occur in novel functional nanomaterials and in nature. Our experimental …

Thermal silicon oxide-to-oxide bonding was investigated at the nanometer level using X-ray
reflectivity, transmission electron microscopy, and infrared absorption spectroscopy. The …

Low temperature direct bonding has been used extensively for assembling materials or
components in the microelectronics and microsystem industries. We review here some key …

The integration of lithium niobate (LiNbO3 or LN) and silicon (Si) has emerged as a
promising heterogeneous platform for microelectromechanical systems (MEMSs) and …

A model of the defect formation at the bonding interface upon annealing in silicon wafer
bonding is proposed in this paper. It is shown that the formation of the bonding defects …

Catalysts are materials that accelerate the rate of a desired chemical reaction. As such, they
constitute an integral part in many applications ranging from the production of fine chemicals …