Origami-like 3-D folded MEMS approach for miniature inertial measurement unit
A Efimovskaya, YW Lin… - Journal of …, 2017 - ieeexplore.ieee.org
This paper presents a miniature 50 mm 3 inertial measurement unit (IMU) implemented
using a folded microelectromechanical systems (MEMS) process. The approach is based on …
using a folded microelectromechanical systems (MEMS) process. The approach is based on …
Glass reflow process for microsystem applications
N Van Toan, S Sangu, T Ono - Journal of Micromechanics and …, 2016 - iopscience.iop.org
This paper reports on a glass reflow process and its applications to microsystems. Glass
compounded silicon structures are achieved using a silicon mold under a high temperature …
compounded silicon structures are achieved using a silicon mold under a high temperature …
Miniature origami-like folded MEMS TIMU
A Efimovskaya, D Senkal… - 2015 Transducers-2015 …, 2015 - ieeexplore.ieee.org
In this paper, we report implementation of a folded MEMS concept, demonstrating a
prototype of Timing and Inertial Measurement Unit (TIMU) in<; 50 mm 3 volume. The …
prototype of Timing and Inertial Measurement Unit (TIMU) in<; 50 mm 3 volume. The …
Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration
This paper reports a prototype of miniature,<; 50 mm 3, Timing and Inertial Measurement
Unit (TIMU), implemented utilizing a Folded MEMS concept. The approach is based on a …
Unit (TIMU), implemented utilizing a Folded MEMS concept. The approach is based on a …
Double-sided process for MEMS SOI sensors with deep vertical thru-wafer interconnects
A Efimovskaya, YW Lin… - Journal of …, 2018 - ieeexplore.ieee.org
This paper reports an approach for co-fabrication of silicon-on-insulator (SOI) sensors with
low-resistance vertical electrical interconnects in thick (up to 600 μm) wafers. The thru-wafer …
low-resistance vertical electrical interconnects in thick (up to 600 μm) wafers. The thru-wafer …
Thru-wafer interconnects for double-sided (TWIDS) fabrication of MEMS
A Efimovskaya, YW Lin… - 2016 IEEE International …, 2016 - ieeexplore.ieee.org
This paper reports a new approach for fabrication of high-aspect ratio low resistance vertical
interconnects, providing an electrical interface between the front-side and the backside of …
interconnects, providing an electrical interface between the front-side and the backside of …
Glass reflow process and its applications
N Van Toan, S Sangu, T Ono - 2016 IEEE 11th Annual …, 2016 - ieeexplore.ieee.org
This work presents the glass reflow process for microsystems. In this process, glass
compounded silicon structures are achieved with the help of vacuum cavities under a high …
compounded silicon structures are achieved with the help of vacuum cavities under a high …