Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry
This article reviews corrosion in electronic packaging mainly in the semiconductor industry
over the world. The previous study was reviewed scientifically to highlight the significant …
over the world. The previous study was reviewed scientifically to highlight the significant …
Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys
AF Schon, NA Castro, A dos Santos Barros, JE Spinelli… - Materials Letters, 2021 - Elsevier
In this study, a number of microstructural characteristics of SAC207 and SAC307 alloys were
quantitatively extracted and utilized in a multiple linear regression (MLR) model. The MLR …
quantitatively extracted and utilized in a multiple linear regression (MLR) model. The MLR …
[PDF][PDF] 电子封装用低银Sn-0.3 Ag-0.7 Cu 钎料研究进展
孔祥霞， 翟军军， 孙凤莲 - 机械工程学报, 2022 - qikan.cmes.org
随着电子封装无铅化, 高集成度需求的不断提升, 开发低成本, 高性能的无铅封装材料对传统含铅
材料进行有效替代已成为全球关注的热点. 目前所开发的Sn-Ag-Cu 系无铅钎料中含银量最低的 …
材料进行有效替代已成为全球关注的热点. 目前所开发的Sn-Ag-Cu 系无铅钎料中含银量最低的 …
Effects of electrolyte towards copper wire metallurgical interconnection in semiconductor
KA Hamid, AH Badarisman, A Jalar… - Journal of Physics …, 2022 - iopscience.iop.org
Copper (Cu) wire has been extensively used in the semiconductors industry to replace gold
wire because of its cost-effectiveness and high performance. However, it has a massive …
wire because of its cost-effectiveness and high performance. However, it has a massive …
Effect of ge doping on electrochemical migration of sac alloys in 0.5 m nacl solution
A Gharaibeh, B Medgyes - 2021 IEEE 27th International …, 2021 - ieeexplore.ieee.org
Electrochemical migration (ECM) behavior of three lead-free alloys: Sn3Ag0. 5Cu (SAC305)
as a reference, SAC305+ 0.1 Ge, and SAC0305+ 0.1 Ge was investigated in 0.5 M NaCl …
as a reference, SAC305+ 0.1 Ge, and SAC0305+ 0.1 Ge was investigated in 0.5 M NaCl …
Investigations on the Corrosion Properties of Sn–1Cu–1Ni–xAg Lead Free Solders in 3.5% NaCl Solution
Due to the directions and environmental legislations from RoHS (Restrictions of Hazardous
Substances), WEEE (World Electrical and Electronic Equipment) and from various countries …
Substances), WEEE (World Electrical and Electronic Equipment) and from various countries …
[PDF][PDF] Research Progress of Low-Silver Sn-0.3 Ag-0.7 Cu Solder for Electronic Packaging
孔祥霞， 翟军军， 孙凤莲 - Journal of Mechanical Engineering - qikan.cmes.org
With the increasing demand for lead-free and high integration of electronic packaging, the
development of low-cost and high-performance lead-free packaging materials to effectively …
development of low-cost and high-performance lead-free packaging materials to effectively …
Effect of ZN Additions on the Electrochemical Migration Behaviour of SAC305 Solder Alloys
LH Ling - 2019 - search.proquest.com
The inclusion of lead within the European Union's Restriction of Hazardous Substances list
has led to a push within the microelectronics industry for a suitable non-lead solder alloy …
has led to a push within the microelectronics industry for a suitable non-lead solder alloy …
Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys/Loh Hwei Ling
HL Loh - 2019 - studentsrepo.um.edu.my
The inclusion of lead within the European Union's Restriction of Hazardous Substances list
has led to a push within the microelectronics industry for a suitable non-lead solder alloy …
has led to a push within the microelectronics industry for a suitable non-lead solder alloy …