A convolutional autoencoder approach for feature extraction in virtual metrology

M Maggipinto, C Masiero, A Beghi, GA Susto - Procedia Manufacturing, 2018 - Elsevier
Exploiting the huge amount of data collected by industries is definitely one of the main
challenges of the so-called Big Data era. In this sense, Machine Learning has gained …

[PDF][PDF] Automatic control and machine learning for semiconductor manufacturing: Review and challenges

GA Susto, S Pampuri, A Schirru… - Proceedings of the …, 2012 - eprints.nuim.ie
Semiconductor manufacturing is one of the most technologically advanced industrial
sectors. Process quality and control are critical for decreasing costs and increasing yield …

DeepVM: A Deep Learning-based approach with automatic feature extraction for 2D input data Virtual Metrology

M Maggipinto, A Beghi, S McLoone, GA Susto - Journal of Process Control, 2019 - Elsevier
Abstract Industry 4.0 encapsulates methods, technologies, and procedures that transform
data into informed decisions and added value in an industrial context. In this regard …

A computer vision-inspired deep learning architecture for virtual metrology modeling with 2-dimensional data

M Maggipinto, M Terzi, C Masiero… - IEEE Transactions …, 2018 - ieeexplore.ieee.org
The rise of industry 4.0 and data-intensive manufacturing makes advanced process control
(APC) applications more relevant than ever for process/production optimization, related …

Virtual metrology modeling of time-dependent spectroscopic signals by a fused lasso algorithm

C Park, SB Kim - Journal of Process Control, 2016 - Elsevier
This paper proposes a fused lasso model to identify significant features in the spectroscopic
signals obtained from a semiconductor manufacturing process, and to construct a reliable …

Global and local virtual metrology models for a plasma etch process

SA Lynn, J Ringwood… - IEEE Transactions on …, 2011 - ieeexplore.ieee.org
Virtual metrology (VM) is the estimation of metrology variables that may be expensive or
difficult to measure using readily available process information. This paper investigates the …

Forward selection component analysis: Algorithms and applications

L Puggini, S McLoone - IEEE transactions on pattern analysis …, 2017 - ieeexplore.ieee.org
Principal Component Analysis (PCA) is a powerful and widely used tool for dimensionality
reduction. However, the principal components generated are linear combinations of all the …

An adaptive machine learning decision system for flexible predictive maintenance

GA Susto, J Wan, S Pampuri, M Zanon… - 2014 IEEE …, 2014 - ieeexplore.ieee.org
Process monitoring and Predictive Maintenance (PdM) are gaining increasing attention in
most manufacturing environments as a means of reducing maintenance related costs and …

Estimation and control in semiconductor etch: Practice and possibilities

JV Ringwood, S Lynn, G Bacelli, B Ma… - IEEE Transactions …, 2009 - ieeexplore.ieee.org
Semiconductor wafer etching is, to a large extent, an open-loop process with little direct
feedback control. Most silicon chip manufacturers rely on the rigorous adherence to a …

Development of the virtual metrology for the nitride thickness in multi-layer plasma-enhanced chemical vapor deposition using plasma-information variables

HJ Roh, S Ryu, Y Jang, NK Kim, Y Jin… - IEEE Transactions …, 2018 - ieeexplore.ieee.org
A phenomenological-based virtual metrology (VM) technique is developed for predicting the
silicon nitride film thickness in multi-layer plasma-enhanced chemical vapor deposition …