The next generation of small form factor (SFF) microsystem technologies can only keep up
with increased functionality and performance demands by using the third dimension. 3D …

Interconnecting integrated circuits (ICs) and 3-D-ICs to the system board (printed circuit
board) are currently achieved using organic or silicon-based interposers. Organic …

Interposer technology has evolved from ceramic to organic materials and most recently to
silicon. Organic substrates exhibit poor dimensional stability, thus requiring large capture …

In this paper, the electrical-thermal co-simulation of 3D systems with Joule heating, fluidic
cooling and air convection effects is proposed. The finite-volume method formulations of …

This paper presents analytical modeling and 3D full-wave electromagnetic (EM) simulation
of the bias voltage dependent semiconductor (MOS) capacitance of a Through Silicon Via …

A device includes an interposer including a substrate, and a first through-substrate via (TSV)
penetrating through the substrate. A glass substrate is bonded to the interposer through a …

Borosilicate glass substrates are widely used in packaging utilizing through-glass-via (TGV)
technology. In this study, we prepared glass substrate samples with different Al 2 O 3 …

This paper presents the integration of WLAN (2.4 and 5 GHz) bandpass filters in glass
interposer using through-package vias. The filters include novel embedded passive …

In this article, we first measured through glass via (TGV) noise coupling and the
effectiveness of shielding structures in a glass interposer. To analyze the noise coupling …

Through silicon via (TSV) technology is key for next generation three-dimensional integrated
circuits, and carbon nanotubes (CNT) provide a promising alternative to metal for filling the …