Advancement of printed circuit board (PCB) surface finishes in controlling the intermetallic compound (IMC) growth in solder joints

A Atiqah, A Jalar, MA Bakar, N Ismail - Recent Progress in Lead-Free …, 2022 - Springer
Printed circuit board (PCB) is widely used in electronic packaging and plays a role in
supporting the electronic components by providing electrical connections for the circuit's …

Reliability analysis of solder joints on rigid-flexible printed circuit board for MEMS pressure sensors under combined temperature cycle and vibration loads with …

X Wang, J Yang, X Liu, P Zheng… - Journal of …, 2022 - asmedigitalcollection.asme.org
The reliability of lead-free solder joints on flexible printed circuit board (PCB) has created
significant new challenges in the industry, especially in automotive electronics, and possibly …

Interfacial Reaction and Corrosion Behaviour Between SAC305 and SAC307 Solder on Electroless Nickel/Immersion Silver (ENImAg) and Electroless Nickel …

MRB Fauzi - 2023 - search.proquest.com
Abstract Tin-Silver-Copper (SAC) solder was recognized as the preferable for lead-free
solder composition, while electroless nickel/immersion gold (ENIG) was recognized as the …

[引用][C] Reliability Analysis of Solder Joints on Rigid-Flexible PCB for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads with …

X Wang, J Yang, X Liu, P Zheng, Q Song, B Song, S Liu - Journal of Electronic …, 2021