Temperature and current density prediction in solder joints using artificial neural network method

Y Liu, X Xu, S Lv, X Zhao, Y Xue, S Zhang… - Soldering & Surface …, 2024 - emerald.com
Purpose Due to the miniaturization of electronic devices, the increased current density
through solder joints leads to the occurrence of electromigration failure, thereby reducing the …

Physics-Informed Learning Based Multiphysics Simulation for Fast Transient TSV Electromigration Analysis

X Yang, H Chen, Y Zhang, T Hou, P Ren… - ACM Transactions on …, 2024 - dl.acm.org
Through Silicon Vias (TSVs) are vulnerable to electromigration (EM) degradation due to
their high local current densities, thereby reducing the reliability of 3D ICs with stack dies …

Linear time electromigration analysis based on physics-informed sparse regression

L Chen, W Jin, M Kavousi… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
In this work, we propose a novel physics-informed sparse regression (PISR) framework to
solve stress evolution (described by Korhonen's equations) in general multisegment wires …

PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks

S Lamichhane, W Jin, L Chen… - 2023 IEEE/ACM …, 2023 - ieeexplore.ieee.org
In this paper, we propose a novel machine learning-based approach, called PostPInn-Em,
for solving the partial differential equations for stress evolution in a confined metal …

Multilayer perceptron-based stress evolution analysis under dc current stressing for multisegment wires

T Hou, P Zhen, N Wong, Q Chen, G Shi… - … on Computer-Aided …, 2022 - ieeexplore.ieee.org
Electromigration (EM) is one of the major concerns in the reliability analysis of very large-
scale integration (VLSI) systems due to the continuous technology scaling. Accurately …

A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis

T Hou, P Zhen, Z Ji, HB Chen - ACM Transactions on Design Automation …, 2023 - dl.acm.org
The electromigration-induced reliability issues (EM) in very large scale integration (VLSI)
circuits have attracted continuous attention due to technology scaling. Traditional EM …

[图书][B] Machine Learning Approaches for VLSI Reliability Analysis

W Jin - 2023 - search.proquest.com
Abstract The reliability of Very Large Scale Integration (VLSI) circuits is crucial in modern
electronic devices. VLSI circuits, which contain millions of transistors, are vulnerable to a …

Hierpinn-em: Fast learning-based electromigration analysis for multi-segment interconnects using hierarchical physics-informed neural network

W Jin, L Chen, S Lamichhane, M Kavousi… - Proceedings of the 41st …, 2022 - dl.acm.org
Electromigration (EM) becomes a major concern for VLSI circuits as the technology
advances in the nanometer regime. The crux of problem is to solve the partial differential …

Analytical Post-Voiding Modeling and Efficient Characterization of EM Failure Effects Under Time-Dependent Current Stressing

T Hou, N Wong, Q Chen, Z Ji… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Electromigration (EM) has become the major concern for integrated circuits (ICs) in
advanced technology nodes. Traditional empirical EM models, such as Black's equation …