Fatigue failure of solder joints is one of the major causes of failure in electronic devices.
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …

Miniaturization as well as manufacturing processes that electronics devices are subjected to
often results in to increase in operational parameters such as current density, temperature …

In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy
(SPM) have been utilized to examine aging induced microstructural changes occurring …

One of the most common method of failure in electronic packaging is the fatigue failure of
solder joints. The constituent materials forming the electronic assembly have different …

Due to growing environmental concerns, lead-free solder materials are being widely used in
electronic assemblies. The Anand viscoplastic constitutive model is frequently used to …

In this work, we have used nanoindentation methods to explore the creep behavior, and
aging effects of SAC305 solder joints at several elevated testing temperatures from 25 to …

In this investigation, the effects of isothermal mechanical cycling on damage accumulation in
lead free SAC305 and SAC_Q (SAC+ Bi) solder joints have been explored. In particular, we …

Failures in solder joints are responsible for about 70% of failures in electronic systems. The
most common failure mode is fatigue failure due to cyclic thermal loading (eg power …

Aging effects are common in lead free solder joints within electronic assemblies that are
exposed to isothermal environments for extended periods. Such exposures lead to evolution …

Aging effects are common in lead free solder joints within electronic assemblies that are
exposed to isothermal environments for extended periods. Such exposures lead to evolution …