Microstructural evolution and interfacial reaction in the eutectic SnBi solder joint on the Ni/Au
metallization with and without the current stressing of 6.5× 10 3 A/cm 2 at 70° C for 5 to 15 …

Effects of current stressing of 6.5× 10 3 A/cm 2 on the eutectic SnBi solder joint at 70° C were
investigated. The Bi segregation at the anode side was found, and the Bi segregation layer …

Effects of silver doping on electromigration behavior of the eutectic SnBi solder are
investigated. Electromigration can induce the Bi migration along with the direction of …

The reliability of the eutectic Sn37Pb (63% Sn37% Pb) and Sn3. 5Ag (96.5% Sn3. 5% Ag)
solder bumps with an under bump metallization (UBM) consisting of an electroless Ni (P) …

SnPb solders have been widely used in many fields because of their excellent solderability.
To respond to environmental and health concerns regarding SnPb solders, it is necessary to …

随着电子产品不断向微型化和多功能化发展, 电子封装微互连中的电迁移问题日益突出,
已成为影响产品可靠性和耐久性的重要因素. 本文在回顾铝, 铜及其合金互连引线中电迁移问题 …

The thermomigration behavior of eutectic tin-lead flip chip solder joints at an ambient
temperature of 150 C was investigated in terms of microstructural evolution, atomic transport …

Abstract Effects of Cu doping on the microstructural evolution in the eutectic SnBi solder
stripes under annealing and current stressing were investigated. Coarsening of the Bi grains …

Electromigration and critical product in eutectic SnPb solder lines at 100C | Journal of Applied
Physics | AIP Publishing Skip to Main Content Umbrella Alt Text Umbrella Alt Text Close …

The electromigration of conventional Sn-37Pb and Pb-free Sn-3.0 Ag-0.5 Cu (in wt.%) solder
bumps was investigated with a high current density of 2.5× 10 4 A/cm 2 at 423 K using flip …