Creep constitutive models suitable for solder alloys in electronic assemblies
S Mukherjee, M Nuhi… - Journal of …, 2016 - asmedigitalcollection.asme.org
Most solders used in electronic systems have low-melting temperature and hence
experience significant amount of creep deformation throughout their life-cycle because …
experience significant amount of creep deformation throughout their life-cycle because …
Reliability of the aging lead free solder joint
Solder materials demonstrate evolving microstructure and mechanical behavior that
changes significantly with environmental exposures such as isothermal aging and thermal …
changes significantly with environmental exposures such as isothermal aging and thermal …
The influence of elevated temperature aging on reliability of lead free solder joints
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
Reduction of lead free solder aging effects using doped SAC alloys
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
The effects of aging temperature on SAC solder joint material behavior and reliability
The effects of aging on mechanical behavior of lead free solders have been examined by
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages
The microstructure, mechanical response, and failure behavior of lead-free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
Shear deformation of lead free solder joints
R Darveaux - … Components and Technology, 2005. ECTC'05., 2005 - ieeexplore.ieee.org
The deformation behavior of lead free solder joints was characterized under shear loading.
The test vehicle was a 0.5 mm pitch wafer level chip scale package (WLCSP). Five alloys …
The test vehicle was a 0.5 mm pitch wafer level chip scale package (WLCSP). Five alloys …
The effects of SAC alloy composition on aging resistance and reliability
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
Creep of thermally aged SnAgCu-solder joints
S Wiese, KJ Wolter - Microelectronics Reliability, 2007 - Elsevier
The creep behaviour of Sn96. 5Ag3. 5-and Sn95. 5Ag3. 8Cu0. 7-solder was studied
specifically for its dependence on technological and environmental factors. The …
specifically for its dependence on technological and environmental factors. The …
Effect of different thermal cycling profiles on the mechanical behavior of SAC305 lead free solder
Lead free solder materials are used as interconnects in electronic assemblies due to their
relatively high melting temperature, mechanical properties, and thermal cycling reliability, as …
relatively high melting temperature, mechanical properties, and thermal cycling reliability, as …