Moisture diffusion and hygroscopic swelling of adhesives in electronics packaging
This paper presents a continuation of the previous hygroscopic characterization work on
epoxy molding compounds, which aims to accurately measure the diffusivity and coefficient …
epoxy molding compounds, which aims to accurately measure the diffusivity and coefficient …
Thermal stress analysis of chip with pressure sensor embedded in accelerometer
CL Lu, MK Yeh - 2017 International Conference on Electronics …, 2017 - ieeexplore.ieee.org
The monolithic integrated sensing chip is developed not only to fulfill but expand more
territories of applications, including consuming electronic devices and automotive …
territories of applications, including consuming electronic devices and automotive …
Reliability and Failure of Microelectronic Materials
A Mavinkurve, RTH Rongen… - Reliability of Organic …, 2022 - Springer
Microelectronics is at the heart of any electronic device these days. The number of
components is exploding, with shortages everywhere. Prolonging product lifetime is highly …
components is exploding, with shortages everywhere. Prolonging product lifetime is highly …
Microscale deformation analysis
D Vogel, M Dost, J Auersperg - Handbook of Silicon Based MEMS Materials …, 2020 - Elsevier
Assessing MEMS devices from the point of view of functional or thermomechanical reliability,
the quantitative knowledge of two basic mechanical characteristics, material strain and …
the quantitative knowledge of two basic mechanical characteristics, material strain and …
Aging of Polymer Adhesives and Its Reliability Impacts to Electronics Packaging
R Liu - 2020 - search.proquest.com
The I/O density growth of the system-on-chip (SoC) technology has been following Moore's
Law, which is approaching its limit due to physical node scaling challenges. 2.5 D …
Law, which is approaching its limit due to physical node scaling challenges. 2.5 D …