Thermomechanical behaviour of environmentally benign Pb-free solders
N Chawla - International Materials Reviews, 2009 - Taylor & Francis
Electronic packaging is a critical part of products such as computers, cellular phones,
automotive components and other electronic devices. The package must be tailored to …
automotive components and other electronic devices. The package must be tailored to …
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties
Abstract Solders based on Sn-Ag alloys are susceptible to microstructural coarsening during
storage or service, resulting in evolution of joint properties, and hence reliability, over time …
storage or service, resulting in evolution of joint properties, and hence reliability, over time …
[HTML][HTML] Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders
Tin-based alloys are commonly used in lead-free solder joints in electronic interconnection
applications, where creep can limit joint reliability. In this work, directionally solidified bulk …
applications, where creep can limit joint reliability. In this work, directionally solidified bulk …
Deformation behavior of tin and some tin alloys
F Yang, JCM Li - Journal of Materials Science: Materials in Electronics, 2007 - Springer
Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to
Pb-free solder applications are reviewed. The results are summarized and evaluated among …
Pb-free solder applications are reviewed. The results are summarized and evaluated among …
Microstructure evolution in a Pb-free solder alloy during mechanical fatigue
MA Matin, WP Vellinga, MGD Geers - Materials Science and Engineering: A, 2006 - Elsevier
Microstructural evolution in a Sn-rich eutectic Sn–3.8 Ag–0.7 Cu solder alloy has been
investigated in low cycle mechanical fatigue. Inhomogeneity in deformation occurred on a …
investigated in low cycle mechanical fatigue. Inhomogeneity in deformation occurred on a …
Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy
MA Matin, EWC Coenen, WP Vellinga, MGD Geers - Scripta Materialia, 2005 - Elsevier
Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8 Ag–0.7 Cu
alloy has been investigated under cyclic thermal loading between 293K and 353K. Fatigue …
alloy has been investigated under cyclic thermal loading between 293K and 353K. Fatigue …
Creep behavior of Bi-containing lead-free solder alloys
D Witkin - Journal of electronic materials, 2012 - Springer
The creep behavior of Sn-3.0 Ag-0.5 Cu (SAC305), Sn-3.4 Ag-1.0 Cu-3.3 Bi (SAC-Bi), and
Sn-3.4 Ag-4.8 Bi (SnAg-Bi, all wt.%) was studied in constant-stress creep tests from room …
Sn-3.4 Ag-4.8 Bi (SnAg-Bi, all wt.%) was studied in constant-stress creep tests from room …
Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder
The creep behavior and hardness of Sn-3.5 Ag-0.7 Cu solder were studied using Berkovich
depth-sensing indentation at temperatures of 25° C to 125° C. Assuming a power-law …
depth-sensing indentation at temperatures of 25° C to 125° C. Assuming a power-law …
Dynamic recrystallization (DRX) as the mechanism for Sn whisker development. Part I: A model
PT Vianco, JA Rejent - Journal of electronic materials, 2009 - Springer
A model is proposed that attributes whisker growth in metals and alloys to dynamic
recrystallization (DRX) and, in particular, DRX at the material surface. Each step in the DRX …
recrystallization (DRX) and, in particular, DRX at the material surface. Each step in the DRX …
Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder
M Erinc, PJG Schreurs, MGD Geers - Mechanics of Materials, 2008 - Elsevier
At present, SnAgCu appears to be the leading lead-free solder in the electronics industry.
Driven by miniaturization, decreasing the component size leads to a stronger influence of …
Driven by miniaturization, decreasing the component size leads to a stronger influence of …