With the development of microelectronic packaging and increasingly specific service
environment of solder joints, much stricter requirements have been placed on the properties …

This review introduces our study on the development of Cu-based nanoparticles suitable as
fillers in the metal–metal bonding process. Colloid solutions of various nanoparticles such …

Highlights•Ni-coated graphene (Ni-GNS) composite reinforcement was prepared by
electroless plating method.•Ni-GNS/SAC305 composite solders were further prepared …

The effect of Ag nanoparticle size on the microstructure of solder matrix, microhardness,
growth of solder/Cu interfacial intermetallic compounds (IMC) and shear strength were …

Sn–Ag–Cu composite solders reinforced with nano-sized, nonreacting, noncoarsening
1wt% TiO2 particles were prepared by mechanically dispersing TiO2 nano-particles into Sn …

In order to identify the effect of the addition of Al nano-particles to eutectic Sn–Ag–Cu solder,
the interfacial microstructure between the solder and Au/Ni metallized Cu pad ball grid array …

This paper investigates the influence of adding nickel (Ni) nanoparticles on the
microstructure, wettability and material properties of Sn–35Bi–1Ag (wt%) based solders …

A method for preparing metallic Cu nanoparticles in aqueous solution is proposed, and
metal–metal bonding with the use of the nanoparticles is demonstrated. The metallic Cu …

In the present investigation, EN31 steel alloy based composite material has been developed
using zirconia toughened alumina as primary reinforcement material and Ni powder as …

In order to identify the effect of the addition of Al and Ni nano-particles to Sn–Ag–Cu solder,
the interfacial microstructure between the composite solders and Organic Solderability …