Soft gels with high toughness have drawn tremendous attention recently due to their
potential applications in flexible electronic fields. The miniaturization and high‐power …

The miniaturization, integration, and high data throughput of electronic chips present
challenging demands on thermal management, especially concerning heat dissipation at …

Modern microelectronics and emerging technologies such as wearable electronics and soft
robotics require elastomers to integrate high damping with low thermal resistance to avoid …

Most elastomers suffer from poor thermal conductivity, which limits their further applications
in various fields, especially for electronic devices. A common method to enhance thermal …

Due to the different coefficients of thermal expansion between the heat generation and heat
dissipation units, the applications of soft high filled composite gels as thermal interface …

Elastomers are regarded as one of the best candidates for the matrix material of soft
electronics, yet they are susceptible to fracture due to the inevitable flaws generated during …

It is highly desirable to develop polydimethylsiloxane (PDMS) elastomers with high self-
healing efficiency and excellent mechanical properties. However, most self-healable …

The ever‐increasing computing power in modern electronics comes with significant heat
waste that can't be ignored. For microchips to dissipate heat efficiently, thermal interface …

Thermal interface materials (TIMs) play a critical role in heat dissipation of modern
electronics with their development towards integration and miniaturization. Shock-induced …

Lightweight materials with high strength and excellent damping capacity are of great
significance for reducing weight and vibration and maintaining stability in industrial …