This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it
introduces the common types of Cu wire available in the market, including bare Cu wire …

In recent years, the selective conversion of CO 2 to fuels and chemicals has been
deliberated as one of the key challenges in the electrochemical CO 2 reduction reaction (CO …

This article reviews corrosion in electronic packaging mainly in the semiconductor industry
over the world. The previous study was reviewed scientifically to highlight the significant …

The structural, elastic and thermodynamic properties of AlCu, Al 2 Cu and Al 4 Cu 9 under
pressure were investigated using a first-principles approach. The volume ratio (V/V 0) and …

First-principles calculations were utilized to study the anisotropic in terms of elasticity, sound
velocity and minimum thermal conductivity of Al–Cu intermetallic compounds (AlCu, c-AlCu …

The densification mechanism of Cu–Al mixed metal powder during a double-action die
compaction was investigated by numerical simulation. The finite element method and …

Copper wire has become a mainstream bonding material in fine-pitch applications due to
the rising cost of gold wire. In recent years, palladium-coated copper (Pd–Cu) wire is being …

In this paper, three Pd-coated Cu (PCC) wires with different Pd-layer thicknesses were used
to make bonding samples, and the influence of Pd-layer thickness on the reliability of …

Seeing that opinions vary, no unanimous conclusion has been drawn on Cu side interfacial
structure and its relationship with the mechanical properties of Cu/Al joints brazed with Zn-Al …

Abstract Cu-30 wt.% Al mixtures produced by mechanical alloying were studied using x-ray
diffractometry (XRD), field emission scanning electron microscopy (FESEM), and …