Rapid advances in antennas, propagation, electromagnetics, and materials are opening
new and unexplored opportunities in body area sensing and stimulation. Next-generation …

We show in this article two fully additively manufactured microwave packages with
integrated active and passive components. Packages were constructed using a chip-first …

With the revolutionary developments in the fields of millimeter-wave (mm-wave) and Internet
of Things (IoT) technologies and the billion devices promised to be implemented by the end …

The implementation of Industry 4.0 has integrated manufacturing, electronics, and
engineering materials, leading to the creation of smart parts (SPs) that provide information …

Backscatter communication is an emerging paradigm for pervasive connectivity of low-
power communication devices. Wirelessly powered backscattering wireless sensor networks …

Information Communication and Technology (ICT) accounts for an increasing share of
global Green House Gas (GHG) emissions. Wireless circuits and systems are indispensable …

This article focuses on improving the robustness of fully additive manufactured packaging
solutions for application-specific, millimeter-wave (mm-wave) system integration. We …

Additive printing is being increasingly used for the fabrication of flexible electronics. Low-
loss interconnects are required to achieve heterogeneous integration for 5G/mm-wave …

In this article, we demonstrate the design, fabrication, and characterization of a-band system-
on-package (SoP). This package is fully additively manufactured using a chip-first process …

This letter presents a 4× 4 Butler matrix realized using stereolithography 3-D printing
technology and liquid metal filling. The matrix is in coaxial technology and relies on circular …