Expected failures in 3-D technology and related failure analysis challenges
After an introduction to 3-D technology, and through silicon via (TSV)-and stacking options,
this paper provides an overview of failures that can be expected in 3-D technology and lists …
this paper provides an overview of failures that can be expected in 3-D technology and lists …
Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM
This paper demonstrates the application of GHz-SAM for the detection of local non-bonded
regions between micron-sized Cu-pads in a wafer-to-wafer hybrid bonded sample. GHz …
regions between micron-sized Cu-pads in a wafer-to-wafer hybrid bonded sample. GHz …
SAM??: New Failure Analysis Methods for Heterogeneous Systems
TS Thomas, K Pressel, F Altmann… - MikroSystemTechnik …, 2019 - ieeexplore.ieee.org
SAM??('Smart Analysis Methods for 3D Integration in Advanced Microsystems and
Corresponding Materials') was a French/German funded project dealing with research and …
Corresponding Materials') was a French/German funded project dealing with research and …
High Resolution Acoustic GHz Microscopy
Abstract Engineers at the Fraunhofer Institute for Microstructure of Materials and Systems
built and are testing a scanning acoustic microscope (SAM) that operates at frequencies of …
built and are testing a scanning acoustic microscope (SAM) that operates at frequencies of …