Wireless powered wearable micro light-emitting diodes

HE Lee, D Lee, TI Lee, JH Shin, GM Choi, C Kim… - Nano Energy, 2019 - Elsevier
Wearable displays are considered as a bilateral communication tool in the hyperconnected
era. Although several electronic clothing display was demonstrated, high power …

Conductive particle detection for chip on glass using convolutional neural network

X Tao, W Ma, Z Lu, Z Hou - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
The detection of conductive particle images is an important part of the chip on glass (COG)
process and can be used to ensure the performance of electrical connections. The …

Ultrafast photoinduced interconnection of metal–polymer composites for fabrication of transparent and stretchable electronic skins

SO Kim, CJ Han, CR Lee, HJ Lee, Y Kim… - ACS applied materials …, 2020 - ACS Publications
The high interest sparked by the foldable smartphones recently released on the market is
gradually shifting to the next generation of flexible electronic devices, such as electronic …

The effect of anisotropic conductive films adhesion on the bending reliability of chip-in-flex packages for wearable electronics applications

JH Kim, TI Lee, TS Kim, KW Paik - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
In this paper, the effects of adhesion properties of anisotropic conductive films (ACFs)
interconnection on the chip-in-flex (CIF) bending reliability were investigated. Oxygen …

Conductive Particles in Anisotropic Conductive Films

FJ Trupp, RM Cibils, SN Goyanes - 2022 - ri.conicet.gov.ar
Anisotropic Conductive Films (ACFs) are the major products used for fine-pitch
interconnection technology in electronic packaging because of their low incidence in …

Highly reliable anisotropic interconnection system fabricated using Cu/Sn-Soldered microdumbbell arrays and polyimide films for application to flexible electronics

HB Ha, BH Lee, N Qaiser, Y Seo, J Kim, JM Koo… - Intermetallics, 2022 - Elsevier
To fabricate high-performance flexible electronics, high-density electronic components
should be safely integrated into limited areas, even under device deformation. However …

A Study on the dynamic bending property of chip-on-flex assembly using anchoring polymer layer anisotropic conductive films

Y Pan, SJ Oh, JH Kim, TS Kim… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
Anisotropic conductive films (ACFs) composed of polymer adhesive resin and conductive
particles have been used as interconnection materials for ultrafine pitch chip-on-flex (COF) …

Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100- -Pitch Flex-on-Flex Assembly Using Anisotropic Conductive …

JH Park, TW Kim, S Zhang… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
There are still many problems in the conductive adhesive, such as particle size and particle
dispersion in the matrix, which can affect the stability of the electrical conductivity. In order to …

Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

JH Park, JC Park, SM Shin… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Solder anisotropic conductive films (ACFs) consist of conductive solder particles, polymer
resin, and flux activator. The flux activator removes solder oxide of solder particles by …

Effects of the types of anisotropic conductive films on the bending reliability of chip-in-plastic packages

JH Kim, JH Kim, KW Paik - IEEE transactions on components …, 2019 - ieeexplore.ieee.org
Chip-in-plastic (CIP) packages using three types of ACFs have been investigated as a
flexible display package solution for high-definition (HD) display applications. By optimizing …