Dynamic electro-thermal simulation of microsystems—a review

T Bechtold, EB Rudnyi, JG Korvink - Journal of micromechanics …, 2005 - iopscience.iop.org
An overview of electro-thermal modeling of microsystems is presented. We consider the
most important coupling between thermal and electrical phenomena, and then focus on the …

Thermal modeling, analysis, and management in VLSI circuits: Principles and methods

M Pedram, S Nazarian - Proceedings of the IEEE, 2006 - ieeexplore.ieee.org
The growing packing density and power consumption of very large scale integration (VLSI)
circuits have made thermal effects one of the most important concerns of VLSI designers …

Fast novel thermal analysis simulation tool for integrated circuits (FANTASTIC)

L Codecasa, V d'Alessandro, A Magnani… - … Investigations of ICs …, 2014 - ieeexplore.ieee.org
This work describes a Fast novel thermal analysis simulation tool for integrated circuits
(FANTASTIC), which is fully automated and relies on an enhanced version of the Multi-Point …

Circuit-based electrothermal simulation of power devices by an ultrafast nonlinear MOR approach

L Codecasa, V d'Alessandro… - IEEE Transactions on …, 2015 - ieeexplore.ieee.org
This paper presents an efficient circuit-based approach for the nonlinear dynamic
electrothermal simulation of power devices and systems subject to radical self-heating. The …

Power blurring: Fast static and transient thermal analysis method for packaged integrated circuits and power devices

A Ziabari, JH Park, EK Ardestani… - … Transactions on Very …, 2014 - ieeexplore.ieee.org
High-temperature and temperature nonuniformity in high-performance integrated circuits
(ICs) can significantly degrade chip performance and reliability. Thus, accurate temperature …

On-line junction temperature monitoring of switching devices with dynamic compact thermal models extracted with model order reduction

F Di Napoli, A Magnani, M Coppola, P Guerriero… - Energies, 2017 - mdpi.com
Residual lifetime estimation has gained a key point among the techniques that improve the
reliability and the efficiency of power converters. The main cause of failures are the junction …

Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation

LH Feng, EB Rudnyi, JG Korvink - IEEE Transactions on …, 2005 - ieeexplore.ieee.org
Compact thermal models are often used during joint electrothermal simulation of
microelectromechanical systems (MEMS) and circuits. Formal model reduction allows …

Delphi-like dynamical compact thermal models using model order reduction

B Rogié, L Codecasa, E Monier-Vinard… - … Investigations of ICs …, 2017 - ieeexplore.ieee.org
Delphi-like Boundary Condition Independent (BCI) Compact Thermal Models (CTMs) are
the standard for modelling single die packages. However their extraction, particularly in the …

Error indicators for fully automatic extraction of heat-transfer macromodels for MEMS

T Bechtold, EB Rudnyi, JG Korvink - Journal of Micromechanics …, 2004 - iopscience.iop.org
In this paper, we present three heuristic error indicators for the iterative model order
reduction of electro-thermal MEMS models via the Arnoldi algorithm. Such error indicators …

Novel approach to the extraction of Delphi-like boundary-condition-independent compact thermal models of planar transformer devices

V Bissuel, L Codecasa, E Monier-Vinard… - … Investigations of ICs …, 2018 - ieeexplore.ieee.org
Planar Magnetic Components are new alternatives to classic transformers. Based on the
combination of a low profile high frequency magnetic core and a Printed Circuit Board, these …