Practically all microelectronic assemblies in use today utilize Pb–Sn solders for
interconnection. With the advent of chip scale packaging technologies, the usage of solder …

The objective of this review is to study interfacial reactions between pure Sn or Sn-rich
solders, and common base metals used in Pb-free electronics production. In particular, the …

Due to the inherent toxicity of lead (Pb), environmental regulations around the world have
been targeted to eliminate the usage of Pb-bearing solders in electronic assemblies. This …

The global adoption and use of photovoltaic modules (PVMs) as the main source of energy
is the key to realising the UN Millennium Development Goals on Green Energy. The …

The harmful effects of lead on the environment and human health, coupled with the threat of
legislation, have prompted a serious search for lead-free solders for electronic packaging …

Table of contents Chapter 1: Introduction to Environmentally Benign Electronics
Manufacturing Chapter 2: Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps …

A new scheme to predict the intermetallic compound which forms first at the substrate/solder
interface during the soldering process has been suggested. A local equilibrium was …

In order to adequately characterize the behavior of solder balls in electronic devices, the
mechanical behavior of solder joints needs to be studied at small length scales. The creep …

The tracer diffusion coefficients of the elements as well as the integrated interdiffusion
coefficients are determined for the Cu 3 Sn and Cu 6 Sn 5 intermetallic compounds using …

In flip chip packaging technology, as the number of input/output contact pads on a chip
surface increases and the diameter of solder bumps decreases, the current density in …